Barcelona Packaging Hub will participate in the Pack Expo Chicago 2024, one of the most important global events in the packaging sector, which will be held from 3 to 6 November at McCormick Place in Chicago. In this edition, the Hub will present several of its partners, EFFYTEC, INVPACK, MENGIBAR, MOVITEC, POSIMAT, UBS and VOLPAK, who will showcase their latest technological innovations and advanced solutions for the packaging industry.
● VOLPAK: will exhibit the ENFLEX F-17 DX and PH-28 machines, focusing on sustainable and innovative packaging solutions for the personal care and pharmaceutical sectors.
● EFFYTEC: will present its advanced packaging solutions, connecting with customers and offering live demonstrations.
● INV Pack: will showcase its flexible single-dose packaging solutions, with the MVA4 EVO and SP6 machines.
● Movitec: together with EAM Mosca Corp., will present end-of-line solutions, highlighting its strapping and wrapping technology.
● POSIMAT: will present innovative solutions for handling empty plastic bottles and caps, improving efficiency in bottling lines.
● UBS will exhibit its modular labeling and coding systems, such as the APL35s, APL 83S, and the high-resolution printers APLINK MRX72e UVLED Dual and TJX UVLED.
● Mengibar: will present advanced filling and capping technologies for the Homecare and Personal Care sectors.
Pack Expo Chicago 2024 will bring together professionals from around the world, offering specialized spaces such as the Sustainability Central, focused on sustainable packaging solutions, and the Innovation Stage, where the most disruptive technologies in the sector will be presented. The participation of Barcelona Packaging Hub in this event reinforces its commitment to internationalization and technological advancement in packaging. The Hub and its partners will present comprehensive solutions that cover the entire packaging cycle, from the design and manufacture of machinery to the implementation of automated systems that maximize efficiency, sustainability and safety in packaging processes.
