The Dieline Summit, new EMBALLAGE and THE DIELINE event

July 23, 2014

Comexposium, organizing company of the international EMBALLAGE show (from November 17 to 20 in Paris Nord Villepinte) collaborates with The Dieline to launch for the first time in France The Dieline Summit - The Peak of Package Design.

The, created by Andrew Gibbs in 2007, is dedicated to packaging design and inspires packaging designers and marketers around the world. After its success, Andrew Gibbs created in the United States a unique event held annually in the USA, “The Dieline Conference”, aimed at professionals in this sector. 
“After our first collaboration at EMBALLAGE 2012, featuring The Dieline Awards winners during the show, we are delighted to be able to go further this year and host Andrew Gibbs and The Dieline Summit in Paris. will help reinforce our promise for 2014: to be the capital event for Packaging innovation. Being able to work with Andrew - a young and talented American designer - allows us to be closer to new market trends, future needs of our clients for their brands ”, says Véronique SESTRIERES, Director of the EMBALLAGE and MANUTENTION salons.
This congress is focused on the future of packaging design and innovation, in the presence of industry leaders. It will be about discussing the problems that are imposed today on designers and consumers globally. It will be presented with a “networking evening” on Sunday November 16, and on Monday November 17 there will be a series of conferences and workshops that will allow professionals in the EMEA area to better understand design in their brand strategy, and in its essential role in terms of packaging design today and tomorrow.

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